UK: PhD Studentship in Engineering - Loughborough University

UK: PhD Studentship in Engineering - Loughborough University
PhD Studentship Under bump metallisation technologies for high
sensitivity
spectroscopic X-ray detectors
Wolfson School of Mechanical and Manufacturing Engineering

*Reference: CL260906*

A PhD Research Studentship jointly funded by Innovative electronics
Manufacturing Research Centre (IeMRC) and CCLRC - Rutherford Appleton
Laboratory (RAL) is available. The successful candidate will be based
at the
Wolfson School of Mechanical and Manufacturing Engineering of
Loughborough
University, but will spend significant time to carry out the research
work
at CCLRC-RAL. Funding is available for 3 years starting on 1 October
2006 or
as soon as hereafter, subject to satisfactory progress. For Home/EU
students
the Research Studentship provides a tax free stipend of ~£15000 p.a.
plus
payment of the Home/EU tuition fee. For overseas students the
additional fee
may be covered by the School, subject to his/her excellence of
qualification. Candidates are expected to hold a good first degree
(First-class, Upper Second-class or equivalent) in Materials Science,
Chemistry, Physics, Engineering or a closely related subject.

The aim of the proposed research is to develop processes of
metallisation
and interconnections suitable for manufacture and assembly of high
sensitivity spectroscopic X-ray detectors. The research will involve
combining experimental exploitation of potential processes with
characterisation and testing of the obtained metallised or
interconnected
structures at micro- to nano- scale. Novel processes such as
electrochemical
and other materials deposition techniques will be particularly explored
to
achieve the goal.

The objectives of the research are:

1. Establish a high yield bump bond interconnect technology in the
UK
for 4keV - 20keV spectroscopic X-ray sensors and advertise the
capability to
the Global Synchrotron Facilities.
2. Identify the physical and chemical structure of under bump
metallisation for the silicon detector layer and the readout
electronics
device, before and after assembly and after accelerated life tests.
3. Establish test procedures for 50um and 100um fine pitch, large
area
chip-on-chip detectors.
4. Establish the exploitation route for fine pitch indium bump
bonding
onto the newly developed UBM systems.
5. Investigate through industrial partners and their commercial
networks other customers and applications.

For further information about the PhD Research Studentship please
contact:

Dr Changqing Liu
Wolfson School of Mechanical and Manufacturing Engineering
Loughborough University
Loughborough, Leicestershire
LE11 3TU, United Kingdom
Tel: +44(0) 1509 227681
e-mail: C.Liu@lboro.ac.uk


For application pack and other admission requirements please contact:

Ms J R Mason
Research Administrator
Wolfson School of Mechanical and Manufacturing Engineering
Loughborough University
Loughborough, Leicestershire
LE11 3TU, United Kingdom
e-mail: J.R.Mason@lboro.ac.uk


*Please Quote Ref: CL260906 on Application Form.*

*Closing date for applications is: 7th November 2006.*


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